Samsung brought a host of innovations to the Flash Memory Summit 2026 that aim to redefine the landscape of memory and storage for future artificial intelligence data centers. Beyond its already announced V10 BV-NAND flash and zHBM concepts, the South Korean giant has revealed new solutions designed to deliver higher performance and better power efficiency, crucial elements to support the increasingly intense workloads required by generative AI models and large-scale machine learning.
zNAND-O targets lower latency for edge AI
Among the most relevant novelties is the zNAND-O, a new high-performance 3D NAND flash memory concept, specifically designed for edge AI computing. Samsung is developing this solution in four-layer and eight-layer versions, aiming to offer lower latency and higher data-transfer speeds than current NAND flash chips. The compact design of zNAND-O allows its integration into a wide range of devices, including laptops, smartphones, tablets, and even robotics, making AI processing faster and more responsive directly on the device without relying solely on the cloud.
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LPDDR5X-PIM integrates processing directly into memory
Another notable innovation is the LPDDR5X-PIM memory chip, which Samsung calls the industry's first LPDDR memory with built-in data processing. Thanks to this architecture, processing occurs directly within the memory chip, reducing the need to move data to the CPU or GPU. This approach not only speeds up operations but also improves energy efficiency, an increasingly critical factor given the enormous amount of energy consumed by AI data centers. The PIM (Processing-In-Memory) technology represents a significant step forward in overcoming the memory bottleneck that often limits performance in AI systems.
PM1763 and BM1773 expand enterprise SSD offerings
As for storage, Samsung showcased its new enterprise SSDs PM1763 and BM1773. The PM1763 is designed for high performance, while the BM1773 is built to maximize storage capacity. Both models were exhibited at FMS 2026 and target data centers that need robust and scalable solutions to handle massive data volumes. These SSDs promise to improve read and write speeds while reducing access times, essential elements to power the most demanding AI workloads.
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Vertical integration as a competitive advantage
Samsung also emphasized that it is the world's only company capable of designing and producing memory and storage chips while also offering contract chip manufacturing on advanced process nodes, including 4nm and below. This vertical integration allows Samsung to provide customers with a one-stop solution spanning memory, logic, foundry, and packaging. This unique capability represents a significant competitive advantage, enabling optimization of the entire supply chain and accelerating the development of customized AI solutions. In an era where the demand for AI infrastructure is constantly growing, the ability to offer an integrated ecosystem could make the difference between an average product and a market leader.
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These innovations fit into a broader context where Samsung is pushing hard on AI, as demonstrated by its recent development of the zHBM memory chip for AI servers. With a clear strategy and an ambitious technological roadmap, the Korean manufacturer confirms itself as a key player in the future of data processing. For those closely following the sector, the announcements at FMS 2026 offer a privileged glimpse into what AI infrastructure will look like in the coming years. More details are available on SamMobile.
Source: https://www.sammobile.com/news/samsung-znand-o-lpddr5x-pim-pm1763-memory-chips-ssd-ai-data-centers
